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| Active-Semi's Lead (Pb) Free and Green Compliance |
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Active-Semi is committed to environment, health and safety excellence. We aim to satisfy or exceed our customers and governmental regulatory requirements with respect to the use of hazardous substances by producing products complying to two directives: Restriction on Hazardous Substances (RoHS) and Waste from Electrical and Electronic Equipment (WEEE). The RoHS Directive mandates that by January 2007 European states will ensure that all electrical and electronic products put on the market contain no heavy metals such as Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent Chromium (Cr(VI)), and two types of brominated flame retardants such as Polybrominated Biphenyls (PBB) or Polybrominated Diphenyl Ether (PBDE). These substances are known to likely pose health and environmental risks.
Active-Semi's Lead (Pb) Free and RoHS Compliance Statement Active-Semi's integrated circuit products are Lead-Free and RoHS compliant and meet the regulatory thresholds for cadmium, hexavalent chromium, lead, mercury, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Definition of Lead-Free Products Active-Semi lead (Pb)-free products have no intentional additions of lead bearing materials. Lead (Pb) may be present as a low level constituent of other metals in the package construction. But the lead content in a lead-free package is less than 0.01 wt.% of the total device weight, and hence RoHS compliant according to the below table. | Hazardous Materials | RoHS Threshold (ppm) | RoHS Threshold (% of wt.) | | Pb (Lead) | 1000 ppm | 0.1% | | Hg (Mercury) | 1000 ppm | 0.1% | | Cd (Cadmium) | 1000 ppm | 0.01% | | Chromium IV (Cr+6) | 1000 ppm | 0.1% | | Polybrominated Biphenols (PBB) | 1000 ppm | 0.1% | | Polybrominated Diphenyl Ethers (PBDE) | 1000 ppm | 0.1% |
RoHS Threshold in ppm and % of weight Note:  Lead (Pb) - free product ordering Currently, most of Active-Semi products are lead (Pb) - free. Please contact our local sale offices for more information. Reliability of Lead Free Plating Product Active-Semi products use 100% Tin (Sn) for their lead plating material. Tin (Sn) has been proven as the industry standard lead finish material, giving acceptable solderability and solder joint performance. The following table summarizes typical reliability test results for Lead Free Plating Qualification at Active-Semi:
| TEST | METHOD | OBSERVATION | RESULT | Solderability Test | 8 and 16 hours bake at
150oC. Dip in SnAgCu solder pot at 245oC (3 seconds), 260oC (10 seconds), and 280oC (10 seconds) | No pin holes or dewetting | PASS | | Plating Thickness Measurements | Under high power microscope inspection | Thickness cpk are under control and acceptable | PASS | | Heat Resistance Test | Bake at 170oC for 2 hours | No discoloration and detachment of plating | PASS | | Lead Fatigue Test | Bend leads to 90o | No detachment of plating | PASS | | Adhesion To Lead Finish Test | Apply sticky clear tape on plating surface | No detachment of plating | PASS | | Temperature Cycle Test | -65oC to 150oC, 1000 cycles | No whisker growth | PASS | | Autoclave Test | 121oC, 100% RH, 96 hours | No whisker growth | PASS | | Temperature Humidity Storage Test | 85oC, 85% RH, 1000 hours | No whisker growth | PASS | | Elevated Temperature Storage Test | 55oC, 65% RH, 2 months | No whisker growth | PASS | | Room Temperature Storage Test | 25oC, 65% RH, 12 months | No whisker growth | PASS |
Green Semiconductor Packaging Active-Semi's packaging partners have adopted the policy of Green Semi-conductor Packaging where our products, production processes, packing and shipping materials are meeting the following requirements:
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